Compact and High Productivity Models
- Radian 3 VPD-ICPMS – Compact high productivity with all-in-one process module
- Radian 7 VPD-ICPMS – Highest productivity with dual all-in-one process modules
High Throughput
- Innovative radial fast-scanning nozzle
- Scans wafer surface in 60 seconds or less
- All-in-one process module
- VPD, scanning, cleaning and drying
- Edge, bevel, front-side and back-side scanning
Fab Integration
- Fully automated OHT interface and SECS-GEM
- Direct bulk chemical connections from facility or bottle supply
- Advance ICPMS integration with automatic tune and autocalibration
High Performance
- Hydrophilic, thick oxide and novel wafer materials
- Immediate transfer and analysis of scan solutions
- Eliminates risk of contamination or evaporation from separate vessel
- Ultra-low 105 - 108 atoms/cm2 detection capability
- Inline preparation of scan solution
- On-demand chemistry based on wafer types